ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,982, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices with insulated source/... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,983, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Interconnects formed using integrated damasc... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,984, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device including conductive st... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,985, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and for... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,986, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Metal insulator metal capacitor (MIM capacit... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,987, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device" was invented by Seongh... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,988, issued on April 7, was assigned to SEIKO EPSON Corp. (Japan). "Integrated circuit device" was invented by Takanori Iwawaki (Suwa, Japa... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,989, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with patterned die backside layer" was inven... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,990, issued on April 7, was assigned to Littelfuse Inc. (Rosemont, Ill.). "Electrically isolated discrete package with high performance cer... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,991, issued on April 7, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China). "Liquid circulating cooling package substra... Read More